To ensure consistent yield control of 3DS-IC products, common criteria for incoming quality control (IQC) and outgoing quality control (OQC) of outsourced subassembly and test (OSAT) are needed. The generic testing flows for different 3DS-IC products defined in this Guide will expedite the progress of 3DS-IC testing.

This Guide will define the criteria for IQC and OQC of OSATs, such as appearance, discoloration, missing ball or crack to clarify the manufacturer’s responsibilities and to improve product yield. This Guide will also define the generic testing flows for different 3DS-IC products, such as chip on chip (CoC), chip on substrate (CoS), chip on wafer (CoW), stacked chip on substrate (SCoS), and wafer on wafer (WoW) to help accelerate the progress of 3DS-IC testing.

Referenced SEMI Standards (purchase separately)

None.

Revision History

SEMI 3D14-0523 (technical revision)

SEMI 3D14-0615 (first published)