NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

This Document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end-of-line tool makers as the basis for defining the limits of manufacturing tolerances.

Referenced SEMI Standards (purchase separately)

None.

Revision History

SEMI G14-88 (technical revision)

SEMI G14-82 (first published)