This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1986; previously published September 1997.
This Specification defines the acceptance criteria for stamped leadframes for plastic molded S.O. packages.
Referenced SEMI Standards SEMI G4 — Specification for Integrated Circuit Leadframe Materials used in the Production of Stamped Leadframes
SEMI G9 — Specification for Stamped Leadframes for Plastic Molded Dual-In-Line Semiconductor Packages
SEMI G10 — Standard Method for Mechanical Measurement for Plastic Package Leadframes
SEMI G21 — Specification for Plating Integrated Circuit Leadframes
