This Test Method describes an evaluation method for bending characteristics of leadframe materials used for L-leaded packages.
This Test Method may be applied to leadframes for L-leaded packages such as QFP, SOP, TSOP, etc.
This Test Method may also be applied to any leadframe materials with thickness ≤0.15 mm.
The Test Method may be used in trim and form tool suppliers, leadframe material suppliers, leadframe manufacturers, and package engineers.
Referenced SEMI StandardsNone.