The purpose of this Test Method is to determine the thermal resistance of semiconductor packages using thermal test chips. This Test Method deals with junction-to-case measurements of thermal resistance in air environment.

The results of this Test Method are used to obtain the junction temperature.

The measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43.

This Test Method uses SI units.

SEMI G30 — Test Method for Junction-to-Case Thermal Resistance Measurements of Ceramic Packages
SEMI G32 — Guideline for Unencapsulated Thermal Test Chip
SEMI G38 — Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages
SEMI G42 — Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages
SEMI G43 — Test Method for Junction-to-Case Thermal Resistance Measurements of Molded Plastic Packages