This Specification describes a common format, content, size, and location for printed, machine-readable labels on an intermediate container of materials used for semiconductor packaging.
This Specification provides for a smooth transition from existing traceability and labeling procedures to a comprehensive, unified system envisioned for the future.
This Standard applies to the following packaging materials:
- Leadframe
- Molding compound
- Bonding wire
- Die attach materials
This Standard applies to only the intermediate container. Barcode specification for shipping pack is referred to EIA 556A or EIAJ barcode specification.
This Standard does not apply to product package label.
Referenced SEMI Standards (purchase separately)
None.
Revision History
SEMI G71-0996 (Reapproved 0823)
SEMI G71-0996 (Reapproved 0318)
SEMI G71-0996 (Reapproved 0811)
SEMI G71-0996 (Reapproved 1104)
SEMI G71-0996 (first published)
