This Standard was technically approved by the Assembly & Packaging Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on March 26, 2015. Available at www.semiviews.org and www.semi.org in June 2015; originally published June 1998; previously published July 2006.

NOTICE: This Document was reapproved with minor editorial changes.

This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape.

Equipment, sampling, and procedures are referred to in the individual test methods.

The test methods for the individual properties have been given in this standard.

Ionic impurities (see SEMI G75.1).

Adhesive strength (see SEMI G75.2).

Peel strength of protective film from leadframe tape (see SEMI G75.3).

Water absorption (see SEMI G75.4).

Weight loss (see SEMI G75.5).

Shrinkage factor (see SEMI G75.6).

Thermal decomposition temperature (see SEMI G75.7).

Coefficient of thermal expansion and glass transition temperature (see SEMI G75.8).

Tensile strength, elongation, and tensile modulus (see SEMI G75.9).

Volume and surface resistivity (see SEMI G75.10).

Dielectric constant and dissipation factor (see SEMI G75.11).

Breakdown strength (see SEMI G75.12).

Leakage current (see SEMI G75.13).

The methods help tape manufacturers, leadframe manufacturers, and their customers in evaluating leadframe tapes.

Subordinate Documents:

SEMI G75.1-0698 (Reapproved 0615) - Test Method for Measurement of Ionic Impurities in Leadframe Tape

SEMI G75.2-0698 (Reapproved 0615) - Test Method for Measurement of Adhesive Strength of Leadframe Tape

SEMI G75.3-0698 (Reapproved 0615) - Test Method for Measurement of the Peel Strength of Protective Film on Leadframe Tape

SEMI G75.4-0698 (Reapproved 0615) - Test Method for Measurement of Water Absorption of Leadframe Tape

SEMI G75.5-0698 (Reapproved 0615) - Test Method for Measurement of Weight Loss of Leadframe Tape

SEMI G75.6-0698 (Reapproved 0615) - Test Method for Measurement of the Shrinkage Factor of Leadframe Tape

SEMI G75.7-0698 (Reapproved 0615) - Test Method for Measurement of Thermal Decomposition Temperature of Leadframe Tape and Adhesive

SEMI G75.8-0698 (Reapproved 0615) - Test Method for Measurement of the Coefficient of Thermal Expansion and Glass Transition Temperature of Leadframe Tape

SEMI G75.9-0698 (Reapproved 0615) - Test Method for Measurement of Tensile Strength, Elongation, and Tensile Modulus of Leadframe Tape

SEMI G75.10-0698 (Reapproved 0615) - Test Method for Measurement of Volume and Surface Resistivity of the Leadframe Tape

SEMI G75.11-0698 (Reapproved 0615) - Test Method for Measurement of the Dielectric Constant and Dissipation Factor of the Leadframe Tape

SEMI G75.12-0698 (Reapproved 0615) - Test Method for Measurement of Breakdown Strength of Leadframe Tape

SEMI G75.13-0698 (Reapproved 0615) - Test Method for Measurement of the Leakage Current in Leadframe Tape

SEMI G29 — Test Method for Trace Contaminants in Molding Compounds
SEMI G59 — Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes