This Test Method defines a procedure for the evaluation of die strength by the mean of 3-point bending method.

This Test Method applies only for 3-point bending method, and other methods will be defined by the separate documents.

This Test Method is used to measure die strength for dies from processed wafers.

Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and certification. This Standard is one of the documents, which describe the Die Strength Evaluation Method, Measurement Data Summary Technique and Data Usage for Test Report.

Referenced SEMI Standards (purchase separately)

None.

Revision History
SEMI G86-0217 (Reapproved 1122)
SEMI G86-0217 (technical revision)
SEMI G86-0303 (Reapproved 0811)
SEMI G86-0303 (first published)