G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling

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Revision:
SEMI G97-0617 - InactiveSEMI G97-0116 - Superseded

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Description


NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

 

This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape.

 

Equipment, sampling, and procedures are referred to in the individual test methods.

 

The test methods for the individual properties have been given in this Standard.

  • Ionic impurities (see SEMI G75.1).
  • Adhesive strength (see SEMI G75.2).
  • Peel strength of protective film from leadframe tape (see SEMI G75.3).
  • Water absorption (see SEMI G75.4).
  • Weight loss (see SEMI G75.5).
  • Shrinkage factor (see SEMI G75.6).
  • Thermal decomposition temperature (see SEMI G75.7).
  • Coefficient of thermal expansion and glass transition temperature (see SEMI G75.8).
  • Tensile strength, elongation, and tensile modulus (see SEMI G75.9).
  • Volume and surface resistivity (see SEMI G75.10).
  • Dielectric constant and dissipation factor (see SEMI G75.11).
  • Breakdown strength (see SEMI G75.12).
  • Leakage current (see SEMI G75.13).


The methods help tape manufacturers, leadframe manufacturers, and their customers in evaluating leadframe tapes.

 

Subordinate Standards (included)

SEMI G75.1-0698 (Reapproved 0615)

SEMI G75.2-0698 (Reapproved 0615)

SEMI G75.3-0698 (Reapproved 0615)

SEMI G75.4-0698 (Reapproved 0615)

SEMI G75.5-0698 (Reapproved 0615)

SEMI G75.6-0698 (Reapproved 0615)

SEMI G75.6-0698 (Reapproved 0615)

SEMI G75.7-0698 (Reapproved 0615)

SEMI G75.8-0698 (Reapproved 0615)

SEMI G75.9-0698 (Reapproved 0615)

SEMI G75.10-0698 (Reapproved 0615)

SEMI G75.11-0698 (Reapproved 0615)

SEMI G75.12-0698 (Reapproved 0615)

SEMI G75.13-0698 (Reapproved 0615)

 

Referenced SEMI Standards (purchase separately)

None.

 

Revision History

SEMI G75-0698 (Reapproved 0615)

SEMI G75-0698 (Reapproved 0706)

SEMI G75-0698 (first published)

 

SEMI G75.1-0698 (Reapproved 0615)

SEMI G75.1-0698 (Reapproved 0706)

SEMI G75.1-0698 (first published)

 

SEMI G75.2-0698 (Reapproved 0615)

SEMI G75.2-0698 (Reapproved 0706)

SEMI G75.2-0698 (first published)

 

SEMI G75.3-0698 (Reapproved 0615)

SEMI G75.3-0698 (Reapproved 0706)

SEMI G75.3-0698 (first published)

 

SEMI G75.4-0698 (Reapproved 0615)

SEMI G75.4-0698 (Reapproved 0706)

SEMI G75.4-0698 (first published)

 

SEMI G75.5-0698 (Reapproved 0615)

SEMI G75.5-0698 (Reapproved 0706)

SEMI G75.5-0698 (first published)

 

SEMI G75.6-0698 (Reapproved 0615)

SEMI G75.6-0698 (Reapproved 0706)

SEMI G75.6-0698 (first published)

 

SEMI G75.7-0698 (Reapproved 0615)

SEMI G75.7-0698 (Reapproved 0706)

SEMI G75.7-0698 (first published)

 

SEMI G75.8-0698 (Reapproved 0615)

SEMI G75.8-0698 (Reapproved 0706)

SEMI G75.8-0698 (first published)

 

SEMI G75.9-0698 (Reapproved 0615)

SEMI G75.9-0698 (Reapproved 0706)

SEMI G75.9-0698 (first published)

 

SEMI G75.10-0698 (Reapproved 0615)

SEMI G75.10-0698 (Reapproved 0706)

SEMI G75.10-0698 (first published)

 

SEMI G75.11-0698 (Reapproved 0615)

SEMI G75.11-0698 (Reapproved 0706)

SEMI G75.11-0698 (first published)

 

SEMI G75.12-0698 (Reapproved 0615)

SEMI G75.12-0698 (Reapproved 0706)

SEMI G75.12-0698 (first published)

 

SEMI G75.13-0698 (Reapproved 0615)

SEMI G75.13-0698 (Reapproved 0706)

SEMI G75.13-0698 (first published)



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