Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these materials require the different characteristics and performances.
The characteristics of encapsulation materials such as wettability needs to be recognized and defined to enable the qualified encapsulation processes for large panel size.
This Specification focuses on the wettability of encapsulation material used in the manufacturing of WLP and PLP processes.
This methodology is defined to measure the wettability by half-angle method.
Referenced SEMI Standards (purchase separately)
SEMI G83 — Specification for Bar Code Marking of Product Packages
Revision History
SEMI G104-1122 (first published)
