Microelectromechanical systems (MEMS) are miniaturized systems requiring packaging for environmental protection and for interconnection. While there are a wide range of MEMS devices, a common need is for packaging that allows movement of the internal device during operation. This is in contrast to the typical integrated circuit that requires only that the device be protected from the environment and that appropriate interconnections are made. In many cases, hermeticity is critical to MEMS device functionality. In other cases, hermeticity is primarily important to reliability of MEMS devices, similarly to integrated circuits. To accelerate improvements of packaged MEMS devices, leading to higher levels of marketplace acceptance, a guide to evaluating hermeticity of MEMS packages is required.

This Guide is intended to provide an overview of hermetic packaging with emphasis on the evaluation of hermeticity of the smaller internal volumes typical of MEMS.

This Guide is directed towards evaluating hermeticity of MEMS packages. Areas to be addressed include materials and equipment for producing and evaluating hermetic seals; methods for detection and measurement of leakage; and considerations and recommendation on evaluation of hermeticity.

This Guide is applicable for use in connection with establishment of evaluation methods and procurement of materials, equipment and facilities relating to manufacturing, quality and reliability assurance for all phases of research, development, and production.

Devices for which this Guide is expected to be relevant include, but are not limited to; gyroscopes and accelerometers, RF MEMS switches, optical mirrors and switches, pressure sensors, resonators, filters, and microfluidics devices including valves and pumps.

Referenced SEMI Standards (purchase separately)
SEMI MS3 — Terminology for MEMS Technology

Revision History
SEMI MS8-0309 (Reapproved 0622)
SEMI MS8-0309 (Reapproved 0915)
SEMI MS8-0309 (first published)