This standard was technically approved by the global Micropatterning Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on April 25, 2007. It was available at www.semi.org in June 2007. Originally published in 1992; previously published in 1996.

NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.

This document defines several standard test patterns to provide consistent industrywide evaluation and testing of micropatterning equipment, metrology instruments, and processes used in integrated circuit manufacturing.

This specification defines the shape, general size, and recommended placement and design rules (where appropriate) of several basic pattern cells for linewidth metrology, resolution testing, and proximity testing. These standard patterns include cells that can be used for optical microscopy, electron microscopy, and electrical probe testing.

This document does not attempt to specify the measurement techniques to be used in verifying critical dimensions for these test patterns on the reticle. Similarly, this document does not attempt to specify how the printed patterns are to be measured on the wafer. This document specifies only what the patterns are supposed to be; it is left to the user to ensure that the actual pattern conforms to this specification, subject to all other applicable SEMI specifications. A separate SEMI document will specify CD measurement conditions (see § 3).

SEMI P24 — CD Metrology Procedures