Tag：StdTpc-Leadframes

G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages

G02800 - SEMI G28 - Specification for Leadframes for Plastic Molded S.O. Packages

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G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

G00400 - SEMI G4 - Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes

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G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes

G05100 - SEMI G51 - Specification for Plastic Molded (Metric) Quad Flat Pack Leadframes

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G07000 - SEMI G70 - Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes

G07000 - SEMI G70 - Standard for Equipment and Leadframe Fixtures for Measurement of Plastic Package Leadframes

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G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様

G00400 - SEMI G4 - スタンピングリードフレーム製品で使用されるICリードフレーム材料の仕様

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G02800 - SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様

G02800 - SEMI G28 - プラスチックモールドS.O.パッケージのリードフレームのための仕様

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G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様

G05100 - SEMI G51 - プラスチックモールド・クアッドフラットパック・リードフレームのための仕様

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G07000 - SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード

G07000 - SEMI G70 - プラスチックパッケージリードフレーム測定用装置とリードフレーム支持具のスタンダード

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G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape

G07500 - SEMI G75 - Standard Test Method of the Properties of Leadframe Tape

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G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology

G05700 - SEMI G57 - Guide for Standardization of Leadframe Terminology

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G04100 - SEMI G41 - Specification for Dual Strip SOIC Leadframe

G04100 - SEMI G41 - Specification for Dual Strip SOIC Leadframe

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G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes

G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes

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G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

G01800 - SEMI G18 - Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

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G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes

G05900 - SEMI G59 - Test Method for Measurement of Ionic Contamination on Leadframe Interleafing and the Contamination Transferred from the Interleafing to the Leadframes

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G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials

G06000 - SEMI G60 - Test Method for the Measurement of Electrostatic Properties of Semiconductor Leadframe Interleafing Materials

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G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages

G06500 - SEMI G65 - Test Method for Evaluation of Leadframe Materials Used for L-Leaded (Gull Wing Type) Packages

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G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds

G06900 - SEMI G69 - Test Method for Measurement of Adhesive Strength Between Leadframes and Molding Compounds

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G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)

G06400 - SEMI G64 - Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)

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