Tag：StdTpc-Package & Chip Carrier Tooling

G09500 - SEMI G95 - Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in the Backend Process

G09500 - SEMI G95 - Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in the Backend Process

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G09500 - SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様

G09500 - SEMI G95 - 後工程における450mmウェーハ用テープフレームカセットのためのロードポートの機械的インタフェースの仕様

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G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer

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G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling

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G09200 - SEMI G92 - 450 mmウェーハ用テープフレームカセットの仕様

G09200 - SEMI G92 - 450 mmウェーハ用テープフレームカセットの仕様

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G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling

G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling

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G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling

G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling

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G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling

G03600 - SEMI G36 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded High Density Tab Quad Semiconductor Package Tooling

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G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling

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G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling

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E18200 - SEMI E182 - Specification for Panel FOUP Loadport for Panel Level Packaging

E18200 - SEMI E182 - Specification for Panel FOUP Loadport for Panel Level Packaging

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