Tag：StdTpc-Process Chemicals - Miscellaneous

C02000 - SEMI C20 - Specification and Guide for Ammonium Fluoride 40%

C02000 - SEMI C20 - Specification and Guide for Ammonium Fluoride 40%

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C03000 - SEMI C30 - Specification and Guide for Hydrogen Peroxide

C03000 - SEMI C30 - Specification and Guide for Hydrogen Peroxide

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C04500 - SEMI C45 - Specification and Guide for Tetraethylorthosilicate (TEOS)

C04500 - SEMI C45 - Specification and Guide for Tetraethylorthosilicate (TEOS)

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C06200 - SEMI C62 - Specification for Progen Precursors Used in Low K CVD Processes

C06200 - SEMI C62 - Specification for Progen Precursors Used in Low K CVD Processes

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C06300 - SEMI C63 - Specification for Organosilicate Precursors Used in Low K CVD Processes

C06300 - SEMI C63 - Specification for Organosilicate Precursors Used in Low K CVD Processes

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C06600 - SEMI C66 - Guide for Trimethylaluminium (TMAI), 99.5% Quality

C06600 - SEMI C66 - Guide for Trimethylaluminium (TMAI), 99.5% Quality

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C02200 - SEMI C22 - Guide for Boron Tribromide

C02200 - SEMI C22 - Guide for Boron Tribromide

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C02600 - SEMI C26 - Specification and Guide for Hexamethyldisilazane (HMDS)

C02600 - SEMI C26 - Specification and Guide for Hexamethyldisilazane (HMDS)

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PV01400 - SEMI PV14 - Guide for Phosphorus Oxychloride, Used in Photovoltaic Applications

PV01400 - SEMI PV14 - Guide for Phosphorus Oxychloride, Used in Photovoltaic Applications

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C02500 - SEMI C25 - Specification for Dichloromethane (Methylene Chloride)

C02500 - SEMI C25 - Specification for Dichloromethane (Methylene Chloride)

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C03000 - SEMI C30 - 過酸化水素の仕様

C03000 - SEMI C30 - 過酸化水素の仕様

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C04500 - SEMI C45 - テトラエトキシシラン (TEOS) ガイドラインと仕様

C04500 - SEMI C45 - テトラエトキシシラン (TEOS) ガイドラインと仕様

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C10100 - SEMI C101 - Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals

C10100 - SEMI C101 - Test Method for Determining pH of Chemical Mechanical Planarization (CMP) Slurries and Related Chemicals

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C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing

C10200 - SEMI C102 - Guide for Reporting Density and Porosity of Chemical Mechanical Planarization (CMP) Polishing Pads Used in Semiconductor Manufacturing

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