Tag：StdVol-MEMS

MS01000 - SEMI MS10 - Test Method to Measure Fluid Permeation Through MEMS Packaging Materials

MS01000 - SEMI MS10 - Test Method to Measure Fluid Permeation Through MEMS Packaging Materials

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MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets

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MS01100 - SEMI MS11 - Specification for Microfluidic Port and Pitch Dimensions

MS01100 - SEMI MS11 - Specification for Microfluidic Port and Pitch Dimensions

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MS00200 - SEMI MS2 - Test Method for Step Height Measurements of Thin Films

MS00200 - SEMI MS2 - Test Method for Step Height Measurements of Thin Films

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MS00300 - SEMI MS3 - Terminology for MEMS Technology

MS00300 - SEMI MS3 - Terminology for MEMS Technology

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MS00400 - SEMI MS4 - Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance

MS00400 - SEMI MS4 - Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance

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MS00500 - SEMI MS5 - Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures

MS00500 - SEMI MS5 - Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures

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MS00800 - SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages

MS00800 - SEMI MS8 - Guide to Evaluating Hermeticity of Microelectromechanical Systems (MEMS) Packages

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MS00600 - SEMI MS6 - Guide for Design and Materials for Interfacing Microfluidic Systems

MS00600 - SEMI MS6 - Guide for Design and Materials for Interfacing Microfluidic Systems

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MS00700 - SEMI MS7 - Specification for Microfluidic Interfaces to Electronic Device Packages

MS00700 - SEMI MS7 - Specification for Microfluidic Interfaces to Electronic Device Packages

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MS00900 - SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices

MS00900 - SEMI MS9 - Specification for High Density Permanent Connections Between Microfluidic Devices

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MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices

MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices

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MS01300 - SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process

MS01300 - SEMI MS13 - Guide for Use of Test Patterns for Characterizing a Deep Reactive Ion Etching (DRIE) Process

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MS01400 - SEMI MS14 - Guide for Critical Parameters of Gas Sensors

MS01400 - SEMI MS14 - Guide for Critical Parameters of Gas Sensors

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