Within the semiconductor industry, the diversity and
complexity of equipment creates difficult challenges for facilities design and
equipment installation. This Guide should benefit equipment suppliers and
semiconductor manufacturers by communicating, in a standardized way, the
information necessary to prepare the facility and to efficiently install
semiconductor equipment.
This Standard applies to the facilities interface of all
semiconductor production equipment and supplier-provided support equipment.
The recommended equipment installation documentation should
cover all installation requirements from receiving until hookup is complete.
The series of data sheets included should address all site
facilities necessary to support semiconductor equipment processing.
The data sheets provide a consistent format for both the
equipment supplier and equipment purchaser to use in compiling and interpreting
equipment installation data.
Referenced SEMI Standards
(purchase separately)
SEMI E30 — Generic Model for Communications and Control of
Manufacturing Equipment (GEM)
SEMI E63 — Mechanical Specification for 300 mm Box
Opener/Loader to Tool Standard (BOLTS-M) Interface
SEMI E70 — Guide for Tool Accommodation Process
SEMI E72 — Specification and Guide for 300 mm Equipment
Footprint, Height, and Weight
SEMI E73 — Specification for Vacuum Pump Interfaces – Dry
Pumps
SEMI E74 — Specification for Vacuum Pump Interfaces –
Turbomolecular Pumps
SEMI E76 — Guide for 300 mm Process Equipment Points of
Connection to Facility Services
SEMI E106 — Provisional Overview Guide to SEMI Standards
for Physical Interfaces and Carriers for 300 mm Wafers
Revision History
SEMI E6-0914 (technical revision)
SEMI E6-0303 (complete rewrite)
SEMI E6-1296 (technical revision)
SEMI E6-96 (technical revision)
SEMI E6-92 (technical revision)
SEMI E6-85 (technical revision)
SEMI E6-84 (technical revision)
SEMI E6-82 (first published)