NOTICE: This Standard or Safety Guideline has an Inactive
Status because the conditions to maintain Current Status have not been met.
Inactive Standards or Safety Guidelines are available from SEMI and continue to
be valid for use.
The purpose of this Specification is to simplify cluster
tool implementation in the fab. Equipment suppliers are required to provide
modules that can be connected into any cluster tool using the specifications
contained herein.
Process and cassette modules accept wafers at locations
that may vary substantially from one module to another. This places a burden on
the capabilities of transport modules to move wafers to and from various
modules in a cluster tool. This Specification defines wafer transport planes
within cassette and process modules. This obviates the wafer transport problem
to a large extent, but does not unduly restrict module content.
This Specification defines the interface plane between
modules in a cluster tool. It provides the mechanical specifications at the
interface that allow modules from different suppliers to be connected together;
no requirements are imposed on the module content.
This Specification is limited to wafers which are 200 mm
(~8 in.) in diameter or smaller and to the interface between cluster tool
modules, with the following exception. The transport module operates across the
interface plane; thus, a definition of the wafer transport plane within
cassette and process modules is required.
Subordinate Standards (included)
SEMI E21.1 — Specification for Cluster Tool Module Interface: Mechanical Interface and Wafer Transport
Referenced SEMI Standards (purchase separately)
None.
Revision History
SEMI E21-1015 (technical revision)
SEMI E21-94 (Reapproved 0309)
SEMI E21-94 (Reapproved 1102)
SEMI E21-94 (Reapproved 0699)
SEMI E21-94 (technical revision)
SEMI E21-91 (first published)
SEMI E21.1-1015 (technical revision)
SEMI E21.1-0309 (technical revision)
SEMI E21.1-1296 (Reapproved 1102)
SEMI E21.1-1296 (technical revision)
SEMI E21.1-92 (first published)
