The purpose of this overview Document is to provide a basic
set of terminology and reference documents for SEMI E49.2, SEMI E49.4, SEMI E49.5,
SEMI E49.6, SEMI E49.7, SEMI E49.8, and SEMI E137.
This Document contains terminology and reference documents used
in SEMI E49.2, SEMI E49.4, SEMI E49.5, SEMI E49.6, SEMI E49.7, SEMI E49.8 and
SEMI E137, which will reference performance and method standards as well as
recommended practices.
The SEMI E49 Subordinate Documents are organized by types
of piping distribution systems: gas, DI/chemical, solvent, and by types of
assembly and testing procedures: subassembly for stainless steel, subassembly
for polymer and final tool assembly. Final assemblies should be tested or
validated for all appropriate parameters (e.g., purity, integrity, failure
rate) as specified in the applicable SEMI E49 Subordinate Documents.
The piping distribution Documents (SEMI E49.2 through SEMI E49.8)
include guidelines for system design, performance, materials, and components.
Purity and performance grades are described for each of the three types of
distribution systems.
Users should complete an overall tool cost of ownership
analysis (see SEMI E35) to determine the optimum application of HP or UHP tool
features. Key parameters should include facilities cost and installation cycle
time, piping system reliability and maintainability factors, tool and subsystem
contribution to contamination, and resultant effects on wafer quality and wafer
throughput factors.
Final assemblies should be evaluated according to the
criteria of SEMI S2 for environmental, health and safety (EH&S) issues
associated with their use.
Subordinate Standards (included)
SEMI E49.2 — Guide for the Qualification of Polymer
Assemblies Used in Ultrapure Water and Liquid Chemical Systems in Semiconductor
Process Equipment
SEMI E49.4 — Guide for Ultrahigh Purity Solvent
Distribution Systems with Metallic Fluid Paths in Semiconductor Manufacturing
Equipment
SEMI E49.5 — Guide for the Design of Ultrahigh Purity
Solvent Distribution Systems with Non-Metallic Fluid Paths in Semiconductor
Manufacturing Equipment
SEMI E49.6 — Guide for Subsystem Assembly and Testing
Procedures – Stainless Steel Systems
SEMI E49.7 — Guide for the Design and Manufacture of Polymer
Assemblies Used for Liquid Chemical Systems in Semiconductor Equipment
SEMI E49.8 — Guide for High Purity and Ultrahigh Purity Gas
Distribution Systems in Semiconductor Manufacturing Equipment
Referenced SEMI Standards (purchase separately)
SEMI E35 — Guide to Calculate Cost of Ownership (COO)
Metrics for Semiconductor Manufacturing Equipment
SEMI E137 — Guide for Final Assembly, Packaging,
Transportation, Unpacking, and Relocation of Semiconductor Manufacturing
Equipment
SEMI S2 — Environmental, Health, and Safety Guideline for
Semiconductor Manufacturing Equipment
Revision History
SEMI E49-0617 (designation update)
SEMI E49-1104 (Reapproved 1211)
SEMI E49-1104 (technical revision)
SEMI E49-0304 (designation update)
SEMI E49-1103 (designation update)
SEMI E49-0702 (technical revision)
SEMI E49-95 (first published)
SEMI E49.1-1104 (replaced by SEMI E137)
SEMI E49.1-0304 (technical revision)
SEMI E49.1-95 (first published)
SEMI E49.2-0617 (complete rewrite)
SEMI E49.2-1104 (technical revision)
SEMI E49.2-0298 (technical revision)
SEMI E49.2-95 (first published)
SEMI E49.3-0298 (Withdrawn 1104) (replaced by SEMI E49.2)
SEMI E49.3-0298 (technical revision)
SEMI E49.3-95 (first published)
SEMI E49.4-0419 (complete rewrite)
SEMI E49.4-0298 (technical revision)
SEMI E49.4-95 (first published)
SEMI E49.5-0419 (complete rewrite)
SEMI E49.5-1104 (technical revision)
SEMI E49.5-0298 (technical revision)
SEMI E49.5-95 (first published)
SEMI E49.6-1103 (Reapproved 1211)
SEMI E49.6-1103 (technical revision)
SEMI E49.6-95 (first published)
SEMI E49.7-0419 (complete rewrite)
SEMI E49.7-0304E (editorial revision)
SEMI E49.7-0304 (technical revision)
SEMI E49.7-0702 (technical revision)
SEMI E49.7-95 (first published)
SEMI E49.8-1103 (Reapproved 1211)
SEMI E49.8-1103 (technical revision)
SEMI E49.8-0298 (technical revision)
SEMI E49.8-96 (first published)
SEMI E49.9-0298 (Withdrawn 0303)
SEMI E49.9-0298 (technical revision)
SEMI E49.9-96 (first published)
