NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.
The application of integrated metrology is anticipated to become a key factor for advanced process control in future integrated circuit (IC) manufacturing. Important parameters, which are typically measured for the characterization and qualification of device manufacturing steps, are the thickness and the optical properties of fabricated layers and the critical dimensions (CD) of submicron structures. For the measurement principle of ellipsometry, which is commonly applied in both applications, different equipment and, hence, procedures and notations for data acquisition and modeling exist. If, therefore, ellipsometry is to be applied for integrated metrology equipment, the physical and the software integration into the equipment should be standardized to avoid efforts for specific installations depending on the equipment and fabrication environment.
This Standard covers reflection ellipsometric measurements in integrated metrology.
This Standard covers the typical applications of ellipsometry, which are the determination of layer thickness and optical properties.
Referenced SEMI Standards
SEMI E30.5 — Specification for Metrology Specific Equipment Model (MSEM)
SEMI E89 — Guide for Measurement System Analysis (MSA)
SEMI E127 — Specification for Integrated Measurement Module Communications: Concepts, Behavior, and Services (IMMC)
SEMI M20 — Practice for Establishing a Wafer Coordinate System
SEMI MF576 — Test Method for Measurement of Insulator Thickness and Refractive Index on Silicon Substrates by Ellipsometry
