The purpose of this Specification is to define a standard equipment capability to report process-related data to the factory system. The subject of this Specification is the activities of a processing location (i.e., process module) that are related to the execution of a recipe.

The collection of process data during recipe execution is important to today’s semiconductor factories to support various applications that help optimize equipment processes, finished product quality, yield, and overall factory performance.

This process data reporting capability provides a factory’s applications the means of linking sampled time series data (Traces) and summary process data to related context data. Standard events that document recipe execution in the process module guarantee the availability of such context information. The context data may include such items as identification of process job, equipment recipe, and affected substrates. The reporting capability provides a record of start and/or end of processing, with granularity to the recipe step level.

Reporting of these events must be process module-specific to support the reporting of process module-specific data parameters. Each process module will typically have a different set of context and process data parameter values. A general event, one that applies to all process chambers, would report the same data, independent of which process module the current event report represents. Such general events do not support reporting of different data sets for each process module, as needed to capture the unique data parameters available from each.

This standard applies to data collection related to the portion of equipment recipe execution that directly affects the processing locations (process modules) within production equipment.

This standard addresses:

• Equipment recipe execution as it directly affects process modules
• Process module state model for recipe execution
• Event reporting for process data collection
• Process context data parameters
• Equipment recipe components and recipe steps contained in the recipe components as they apply to process modules

Referenced SEMI Standards
 

SEMI E5 — SEMI Equipment Communications Standard 2 Message Content (SECS-II)
SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)
SEMI E40 — Standard for Processing Management
SEMI E87 — Specification for Carrier Management (CMS)
SEMI E90 — Specification for Substrate Tracking
SEMI E120 — Specification for the Common Equipment Model (CEM)
SEMI E125 — Specification for Equipment Self-Description (EqSD)
SEMI E134 — Specification for Data Collection Management (DCM)
SEMI E139 — Specification for Recipe and Parameter Management (RaP)