This specification was technically approved by the global Silicon Wafer Committee and is the direct responsibility of the Japanese Silicon Wafer Committee. Current edition approved by the Japanese Regional Standards Committee on August 8, 2003. Initially available at www.semi.org September 2003; to be published November 2003. Originally published December 1996.

This specification defines a container for safe transportation of 300 mm wafers from a wafer maker to a receiving dock of an IC maker site.

SEMI E1.9 — Provisional Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E57 — Provisional Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer Carriers