This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www.semi.org in October 2010. Originally published November 2001.

NOTICE: This document was balloted and approved for withdrawal in 2010.

The purpose of this document is to provide a guide for evaluation of chemical-mechanical polishing (CMP) processes of thin films on unpatterned silicon substrates. This includes recommended procedures for process testing and reporting formats. This guide is intended for use by both suppliers and end users.

SEMI E89 — Guide for Measurement System Analysis (MSA)
SEMI M1 — Specifications for Polished Single Crystal Silicon Wafers
SEMI M20 — Specification for Establishing a Wafer Coordinate System
SEMI M62 — Specifications for Silicon Epitaxial Wafers