This Specification is intended to provide a marking symbology that can be used to mark glass carrier characteristics for panel level packaging (PLP).
This Specification defines the geometric shape, size and content of a rectangular two-dimensional (2D) code symbol for back surface marking of the glass carrier for use in PLP applications.
Although this Specification does not specify the marking techniques that may be employed when complying with its requirements, it is assumed that the symbol is laser marked with individual dots.
Referenced SEMI Standards (purchase separately)
SEMI 3D23 — Specification for Glass Characteristics for Panel Level Packaging (PLP) Applications
Revision History
SEMI T24-1222 (first published)
