Tag：StdVol-Traceability

M01200 - SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers

M01200 - SEMI M12 - Specification for Serial Alphanumeric Marking of Silicon Wafers

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M01300 - SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers

M01300 - SEMI M13 - Specification for Alphanumeric Marking of Silicon Wafers

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T01000 - SEMI T10 - Test Method for the Assessment of 2D Data Matrix Direct Mark Quality

T01000 - SEMI T10 - Test Method for the Assessment of 2D Data Matrix Direct Mark Quality

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T01100 - SEMI T11 - Specification for Marking of Hard Surface Reticle Substrates

T01100 - SEMI T11 - Specification for Marking of Hard Surface Reticle Substrates

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T01500 - SEMI T15 - Specification for Jig ID: Concept

T01500 - SEMI T15 - Specification for Jig ID: Concept

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T01600 - SEMI T16 - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks

T01600 - SEMI T16 - Specification for Use of Data Matrix Symbology for Automated Identification of Extreme Ultraviolet Lithography Masks

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T01700 - SEMI T17 - Specification of Substrate Traceability

T01700 - SEMI T17 - Specification of Substrate Traceability

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T01800 - SEMI T18 - Specification of Parts and Components Traceability

T01800 - SEMI T18 - Specification of Parts and Components Traceability

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T01900 - SEMI T19 - Specification for Device Marking

T01900 - SEMI T19 - Specification for Device Marking

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T02000 - SEMI T20 - Specification for Authentication of Semiconductors and Related Products

T02000 - SEMI T20 - Specification for Authentication of Semiconductors and Related Products

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T02100 - SEMI T21 - Specification for Organization Identification by Digital Certificate Issued from Certificate Service Body (CSB) for Anti-Counterfeiting Traceability in Components Supply Chain

T02100 - SEMI T21 - Specification for Organization Identification by Digital Certificate Issued from Certificate Service Body (CSB) for Anti-Counterfeiting Traceability in Components Supply Chain

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T02200 - SEMI T22 - Specification for Traceability by Self Authentication Service Body and Authentication Service Body

T02200 - SEMI T22 - Specification for Traceability by Self Authentication Service Body and Authentication Service Body

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T02300 - SEMI T23 - Specification for Single Device Traceability for the Supply Chain

T02300 - SEMI T23 - Specification for Single Device Traceability for the Supply Chain

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T00300 - SEMI T3 - Specification for Wafer Box Labels

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T00400 - SEMI T4 - Specification for 150 mm and 200 mm Pod Identification Dimensions

T00400 - SEMI T4 - Specification for 150 mm and 200 mm Pod Identification Dimensions

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T00500 - SEMI T5 - Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers

T00500 - SEMI T5 - Specification for Alphanumeric Marking of Round Compound Semiconductor Wafers

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T00700 - SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

T00700 - SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol

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T00800 - SEMI T8 - Specification for Marking of Glass Flat Panel Display Substrates with a Two-Dimensional Matrix Code Symbol

T00800 - SEMI T8 - Specification for Marking of Glass Flat Panel Display Substrates with a Two-Dimensional Matrix Code Symbol

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