This Standard was technically approved by the Micropatterning Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 1, 2013. Available at www.semiviews.org and www.semi.org in June 2013; originally published November 2001; previously published November 2009.
NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use.
There are two main purposes of this Standard:
• To define key specifications for EUV substrates that ensure physical dimensional compatibility with EUV carriers, process equipment, and EUV scanners;
• To identify and define key properties of EUV substrates and blanks which should be specified in the purchase order between users and suppliers.
This Standard details the physical characteristics and tolerances required for EUV substrates.
This Standard details select film definitions and specifications required for EUV Blanks.
This Standard details additional specifications which should be included in purchase orders for substrates and
Referenced SEMI StandardsSEMI P1 — Specification for Hard Surface Photomask Substrates